eagle-i The Ohio State UniversityThe Ohio State University

SET FC150 Flip Chip Bonder

eagle-i ID


Resource Type

  1. Flip chip bonder


  1. Resource Description
    SET FC150 Flip Chip Bonder
  2. Additional Name
    Flip Chip Bonder
  3. Contact
    Nantech West Lab
  4. Website(s)
  5. Part of Collection
    Office of Research Collection
  6. Part of Collection
    Institute for Material Research
  7. Location
    Nanotech West Lab
Provenance Metadata About This Resource Record

    Copyright © 2016 by the President and Fellows of Harvard College
    The eagle-i Consortium is supported by NIH Grant #5U24RR029825-02 / Copyright 2016