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The Ohio State UniversityThe Ohio State University

SET FC150 Flip Chip Bonder

eagle-i ID

http://eagle-i.rf.ohio-state.edu/i/00000174-b6ee-a082-b8fb-15ae80000000

Resource Type

  1. Flip chip bonder

Properties

  1. Resource Description
    SET FC150 Flip Chip Bonder
  2. Additional Name
    Flip Chip Bonder
  3. Contact
    Nantech West Lab
  4. Part of Collection
    Office of Research Collection
  5. Part of Collection
    Institute for Material Research
  6. Location
    Nanotech West Lab
 
RDFRDF
 
Inferred Types from the eagle-i Ontology (What is an ontology?)
Provenance Metadata About This Resource Record

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